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Han, Yafang. editor.
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Lecture Notes in Mechanical Engineering,
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Hosmani, Santosh S. author.
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Mechanical engineering.
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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint
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, readability and novel content, it is a valuable resource for researchers and graduates working in mechanical
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Theoretical and Applied Mechanics.
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Engineering Thermodynamics, Heat and Mass Transfer.
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Continuum Mechanics and Mechanics of Materials.
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Engineering.
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Siginer, Dennis A. author.
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Engineering Thermodynamics, Heat and Mass Transfer.
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Theoretical and Applied Mechanics. http://scigraph.springernature.com/things/product-market-codes/T
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