Search Results for Reliability.

Durability of Critical Infrastructure, Monitoring and Testing Proceedings of the ICDCF 2016

Yazar

Kravcov, Alexander. editor.

https://doi.org/10.1007/978-981-10-3247-9

Format:

Electronic Resources

Alıntı:

Quality Control, Reliability, Safety and Risk. http://scigraph.springernature.com/things/product

High Tech Concrete: Where Technology and Engineering Meet Proceedings of the 2017 fib Symposium, held in Maastricht, The Netherlands, June 12-14, 2017

Yazar

Hordijk, D.A. editor.

https://doi.org/10.1007/978-3-319-59471-2

Format:

Electronic Resources

Alıntı:

: materials technology, modelling, testing and design, special loadings, safety, reliability and codes

Best Practices for the Use of Simulation in POD Curves Estimation Application to UT Weld Inspection

Yazar

Chapuis, Bastien. author.

https://doi.org/10.1007/978-3-319-62659-8

Format:

Electronic Resources

Alıntı:

reliability. It focuses on ultrasonic testing (UT) weld inspection but many of the principles can be applied

Reinforced Concrete Design to Eurocode 2

Yazar

Toniolo, Giandomenico. author.

https://doi.org/10.1007/978-3-319-52033-9

Format:

Electronic Resources

Alıntı:

consequent degree of reliability of results. Each chapter develops an organic topic, which is eventually

Fracture at all Scales

Yazar

Pluvinage, Guy. editor.

https://doi.org/10.1007/978-3-319-32634-4

Format:

Electronic Resources

Alıntı:

vessels and boilers) • safety and reliability of welded joints This book includes 12 contributions from

Prognostics and Health Management of Engineering Systems An Introduction

Yazar

Kim, Nam-Ho. author.

https://doi.org/10.1007/978-3-319-44742-1

Format:

Electronic Resources

Alıntı:

sensing technologies, physics of failure, machine learning, modern statistics, and reliability engineering

Materials for Advanced Packaging

Yazar

Lu, Daniel. editor.

https://doi.org/10.1007/978-3-319-45098-8

Format:

Electronic Resources

Alıntı:

Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability

3D Microelectronic Packaging From Fundamentals to Applications

Yazar

Li, Yan. editor.

https://doi.org/10.1007/978-3-319-44586-1

Format:

Electronic Resources

Alıntı:

Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation

Smart Structures and Materials Selected Papers from the 7th ECCOMAS Thematic Conference on Smart Structures and Materials

Yazar

Araujo, Aurelio L. editor.

https://doi.org/10.1007/978-3-319-44507-6

Format:

Electronic Resources

Alıntı:

, N. Jouandeau, L. Gallimard, and O. Polit -- Reliability Analysis of Variable Stiffness Composite

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