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1. 
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability için kapak resmi
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Yazar 
Lee, Tae-Kyu. author.
http://dx.doi.org/10.1007/978-1-4614-9266-5
Format: 
Electronic Resources
Alıntı: 
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability / Lee
2. 
Thermal Management for LED Applications için kapak resmi
Thermal Management for LED Applications
Thermal Management for LED Applications
Yazar 
Lasance, Clemens J.M. editor.
http://dx.doi.org/10.1007/978-1-4614-5091-7
Format: 
Electronic Resources
Alıntı: 
Solid State Lighting Technology and Application Series,
3. 
Poly-SiGe for MEMS-above-CMOS Sensors için kapak resmi
Poly-SiGe for MEMS-above-CMOS Sensors
Poly-SiGe for MEMS-above-CMOS Sensors
Yazar 
Gonzalez Ruiz, Pilar. author.
http://dx.doi.org/10.1007/978-94-007-6799-7
Format: 
Electronic Resources
Alıntı: 
Characterization and Evaluation of Materials.
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3 sonuç bulundu Arama sonuçlarına abone ol

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