4 sonuç bulundu Arama sonuçlarına abone ol
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1. 
Materials for Advanced Packaging için kapak resmi
Materials for Advanced Packaging
Materials for Advanced Packaging
Yazar 
Lu, Daniel. editor.
https://doi.org/10.1007/978-3-319-45098-8
Format: 
Electronic Resources
Alıntı: 
Optical and Electronic Materials. http://scigraph.springernature.com/things/product-market-codes/Z
2. 
RF and Microwave Microelectronics Packaging II için kapak resmi
RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Yazar 
Kuang, Ken. editor.
https://doi.org/10.1007/978-3-319-51697-4
Format: 
Electronic Resources
Alıntı: 
Electronics and Microelectronics, Instrumentation. http://scigraph.springernature.com/things
3. 
3D Microelectronic Packaging From Fundamentals to Applications için kapak resmi
3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Yazar 
Li, Yan. editor.
https://doi.org/10.1007/978-3-319-44586-1
Format: 
Electronic Resources
Alıntı: 
Optical and Electronic Materials. http://scigraph.springernature.com/things/product-market-codes/Z
4. 
Fan-Out Wafer-Level Packaging için kapak resmi
Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Yazar 
Lau, John H. author.
https://doi.org/10.1007/978-981-10-8884-1
Format: 
Electronic Resources
Alıntı: 
Optical and Electronic Materials. http://scigraph.springernature.com/things/product-market-codes/Z
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4 sonuç bulundu Arama sonuçlarına abone ol

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