Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Başlık:
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
Yazar:
Li, Er-Ping, author.
ISBN:
9781118166727
Yazar:
Fiziksel Niteleme:
1 PDF (224 pages).
Genel Not:
Includes index.
İçindekiler:
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.
Konu Başlığı:
Tür:
Elektronik Erişim:
Abstract with links to resource http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551