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Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer
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Engineering Materials,
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Mechanical Engineering Series,
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Fassi, Irene. editor.
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Engineering Design. http://scigraph.springernature.com/things/product-market-codes/T17020
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Jackson, Mark J. editor.
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Mechanical Engineering. http://scigraph.springernature.com/things/product-market-codes/T17004
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Uemura, Tomomasa. author.
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Engineering Fluid Dynamics. http://scigraph.springernature.com/things/product-market-codes/T15044
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