Preface (Ronald W. Gedney) -- Contributors -- Introduction (Jasbir Bath and Carol A. Handwerker) -- Lead-Free Assembly Project -- Alloy Group -- Process Group -- Component Group -- Reliability Group -- Follow-On Projects/Work -- 1. Alloy Selection (Carol A. Handwerker, Ursula Kattner, Kilwon Moon, Jasbir Bath, Edwin Bradley, and Polina Snugovsky) -- 1.1. Introduction -- 1.2. Lead-Free Alloys Considered by iNEMI in 1999 as Replacements for Tin¿́¿Lead Eutectic Solder -- 1.3. Fundamental Properties of Lead-Free Solder Alloys Affecting Manufacturing and Reliability -- 1.4. R&D Issues Remaining in Lead-Free Solder Implementation -- 1.5. Summary -- References -- 2. Review and Analysis of Lead-Free Solder Material Properties (Jean-Paul Clech) -- 2.1. Introduction -- 2.2. Tin¿́¿Lead Properties and Models -- 2.3. Tin¿́¿Silver Properties and Creep Data -- 2.4. Tin¿́¿Silver¿́¿Copper Properties and Creep Data -- 2.5. Alloy Comparisons -- 2.6. General Conclusions/Recommendations -- Appendix A: Tin¿́¿Silver Creep Data -- Appendix B: Tin¿́¿Silver¿́¿Copper Creep Data -- Acknowledgments -- References -- 3. Lead-Free Solder Paste Technology (Ning-Cheng Lee) -- 3.1. Introduction -- 3.2. Materials -- 3.3. Rheology -- 3.4. Applications -- 3.5. Reflow Soldering -- 3.6. Microstructures of Reflowed Joints -- 3.7. Challenges of Lead-Free Reflow Soldering -- 3.8. Summary -- References -- 4. Impact of Elevated Reflow Temperatures on Component Performance (Richard D. Parker, Jack MCCullen, Nick Lycoudes, and R. J. Arvikar) -- 4.1. Introduction to Component ¿́¿Lead-Free¿́¿ Issues -- 4.2. Moisture/Reflow Impact on Packaged Integrated Circuits -- 4.3. Impact of Increased Solder Peak Reflow Temperatures on Moisture Sensitivity Level Ratings -- 4.4. Impact of Increased Solder Peak Reflow Temperatures -- 4.5. Observations on Profiling for the Lead-Free Reflow Processes -- 4.6. IC Package Improvement Options for Better Package MSL at Higher Lead-Free Solder Reflow Temperatures.

4.7. Frequency Control Products -- 4.8. ¿́¿Lead-Free¿́¿ Cost Impact on Components -- 4.9. Packaging Identification of Lead-free Packaged ICs -- 4.10. Conclusions -- Acknowledgments -- References -- 5. Lead-Free Assembly Reliability¿́¿General (Edwin Bradley) -- 5.1. Introduction -- 5.2. Basic Physical Properties of Solder -- 5.3. Creep Deformation -- 5.4. Thermal Fatigue -- 5.5. Creep Rupture -- 5.6. Isothermal (Mechanical) Fatigue -- 5.7. Out-of-Plane Bending -- 5.8. Impact/Shock Loading -- 5.9. Effect of Rework on Reliability -- 5.10. High-Temperature Operating Life (HTOL) -- 5.11. Electrochemical Migration -- 5.12. Tin Whiskering -- 5.13. Tin Pest -- 5.14. Summary -- Acknowledgments -- References -- 6. Lead-Free Assembly Reliability: iNEMI Evaluation and Results (Elizabeth Benedetto and John Sohn) -- 6.1. Reliability Team Goals -- 6.2. Reliability Test Matrix -- 6.3. Component-Paste-Board Finish Combinations -- 6.4. Components -- 6.5. Test Vehicles -- 6.6. Pre-Test/Post-Assembly Information -- 6.7. CTE Determination: Component and Boards -- 6.8. Thermal Cycling Conditions -- 6.9. Failure Criteria -- 6.10. Thermal Cycle Relative Performance -- 6.11. Failure Data, Analysis Packages -- 6.12. Weibull Analyses -- 6.13. Post-Cycling Failure Analysis -- 6.14. Bend Testing -- 6.15. Electrochemical Migration Testing [36, 37] -- 6.16. iNEMI Team Conclusions -- 6.17. Overall Summary, Conclusions -- 6.18. ASTM Test Methods -- References -- 7. Tin Whiskers: Mitigation Strategies and Testing (Heidi L. Reynolds, C. J. Lee, and Joe Smetana) -- 7.1. Introduction -- 7.2. Mitigation Strategies -- 7.3. Tin Whisker Test Development -- 7.4. Summary -- Acknowledgments -- References -- 8. Lead-Free Reflow and Rework (Jasbir Bath) -- 8.1. Introduction -- 8.2. Printability of Lead-Free Solder Pastes -- 8.3. Soak Versus Ramp Temperature Profiles -- 8.4. Effect of Peak Temperature Versus Reflow Performance -- 8.5. Effect of Reflow Atmosphere on Solderability of Lead-Free Solder.

8.6. Convection Versus IR Reflow Ovens -- 8.7. Reflow Temperature Delta on Boards and Components -- 8.8. Visual Inspection of Lead-Free Soldered Joints -- 8.9. Automated Optical Inspection (AOI) -- 8.10. X-ray Inspection of Lead-Free Soldered Joints -- 8.11. Acoustic Microscopy Inspection of Components Before and After Lead-Free Reflow -- 8.12. Lead-Free Rework of BGA/CSP Soldered Joints -- 8.13. Lead-Free Hand-Soldering Rework -- 8.14. In-Circuit Testing and Functional Testing (ICT/FT) of Soldered Joints -- 8.15. Yield Data -- 8.16. Surface-Mount Fillet Lifting and Reliability of Reflowed Soldered Joints -- 8.17. Conclusions -- 8.18. Future Work -- Acknowledgments -- References -- 9. Case Study: Pb-Free Assembly, Rework, and Reliability Analysis of IPC Class 2 Assemblies (Jerry Gleason, Charlie Reynolds, Matt Kelly, Jasbir Bath, Quyen Chu, Ken Lyjak, and Patrick Roubaud) -- 9.1. Introduction -- 9.2. Approach and Strategy -- 9.3. Observations and Results -- 9.4. Conclusions -- 9.5. Summary -- Acknowledgments -- References -- 10. Implementing RoHS and WEEE-Compliant Products (Jim MCElroy and Cynthia Williams) -- 10.1. Introduction -- 10.2. Are Your Products within the Scope of the EU ROHS? -- 10.3. Ten Steps to ROHS Compliance -- 10.4. Part Numbering Important for Differentiating Lead-Free from Tin¿́¿Lead Components and Boards -- 10.5. A Standards-Based Approach to Materials Declaration -- 10.6. Standards -- 10.7. High-Reliability Requirements -- 10.8. Business Impact of Supply Chain Conversion -- 10.9. Summary -- References -- Index.