Implementation of Piezoelectric MEMS Resonators -- Reliability and Quality Assessment (Stability and Packages

and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of

Packaging -- MEMS Packaging -- LED Die Bonding -- Medical Electronics Design, Manufacturing, and Reliability

Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation