Yazar
Lu, Daniel. editor.
Format:
Electronic Resources
Alıntı:
Chip-to-Substrate Connections -- Advanced Wire Bonding Technology: Materials, Methods, and Testing -- Lead-Free
View Other Search Results
Yazar
Li, Yan. editor.
Format:
Electronic Resources
Alıntı:
in 3D packaging -- Fundamental of Thermal Compression Bonding Technology and Process Materials for 2
View Other Search Results
Arama Sonuçlarını Sınırlandır
Daraltılmış: