Sensitive Inputs on the Reliability of Nanoscale Circuits -- Pin Count and Wire Length Optimization for

structure (lateral and vertical); iii) reliability and robustness of GaN-power transistors; iv) impact of

on the speed and reliability of current-generation SiGe circuits and highlights emerging innovations

improve the performance, reliability and integration of 3D integrated circuits (ICs). This book will be

aspects of dark silicon-aware architectures including design, management, reliability, and test. Readers

: process, devices, and systems; •Explains the use of wireless 3D integration to improve 3D IC reliability

design trade-offs; • to demonstrate the reliability and functionality of the developed building blocks by

System-Level Design for Reliability: RF Front-End Application -- The Backtracking Search for the Optimal Design

such as SoC architecture, hardware accelerator, software development environment, and reliability

and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of

Memory Technology, Design and Reliability -- SONOS 1Tr eFlash memory -- SONOS split-gate eFlash memory.

Interconnections in Stacked Packaging -- Interconnect Quality and Reliability of 3D Packaging -- Fault isolation