Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC
tarafından
 
Li, Er-Ping, author.

Başlık
: 
Electrical modeling and design for 3D system integration : 3D integrated circuits and packaging, signal integrity, power integrity and EMC

Yazar
: 
Li, Er-Ping, author.

ISBN
: 
9781118166727

Yazar
: 
Li, Er-Ping, author.

Fiziksel Niteleme
: 
1 PDF (224 pages).

Genel Not
: 
Includes index.

İçindekiler
: 
Macromodeling of Complex Interconnects in 3D Integration -- 2.5D Simulation Method for 3D Integrated Systems -- Hybrid Integral Equation Modeling Methods for 3D Integration -- Systematic Microwave Network Analysis for 3D Integrated Systems -- Modeling of Through-Silicon Vias (TSV) in 3D Integration.

Konu Başlığı
: 
Three-dimensional integrated circuits.

Tür
: 
Electronic books.

Ek Kurum Yazar
: 
IEEE Xplore (Online Service),
 
Wiley InterScience (Online service),

Elektronik Erişim
: 
Abstract with links to resource http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=6183551


Materyal TürüBarkodYer NumarasıDurumu/İade Tarihi
Electronic Book15522-1001TK7874.893 .E7 2012 EBIEEE