Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
tarafından
Cheng, Jie. author.
Başlık
:
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect
Yazar
:
Cheng, Jie. author.
ISBN
:
9789811061653
Yazar
:
Cheng, Jie. author.
Edisyon
:
1st ed. 2018.
Fiziksel Niteleme
:
XVIII, 137 p. 103 illus. online resource.
Seri
:
Springer Theses, Recognizing Outstanding Ph.D. Research,
Özet
:
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
Konu Başlığı
:
Manufactures.
Chemistry, inorganic.
Electronics.
Manufacturing, Machines, Tools, Processes. http://scigraph.springernature.com/things/product-market-codes/T22050
Tribology, Corrosion and Coatings. http://scigraph.springernature.com/things/product-market-codes/Z15000
Electronics and Microelectronics, Instrumentation. http://scigraph.springernature.com/things/product-market-codes/T24027
Ek Kurum Yazar
:
SpringerLink (Online service)
Elektronik Erişim
:
Materyal Türü | Barkod | Yer Numarası | Durumu/İade Tarihi |
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Electronic Book | 224494-1001 | TS1 -2301 | Springer E-Book Collection |