Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
tarafından
 
Seok, Seonho. author.

Başlık
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Yazar
Seok, Seonho. author.

ISBN
9783319778723

Yazar
Seok, Seonho. author.

Edisyon
1st ed. 2018.

Fiziksel Niteleme
VIII, 115 p. 106 illus. online resource.

Seri
Springer Series in Advanced Manufacturing,

İçindekiler
Overview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. .

Özet
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films – a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load–displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Konu Başlığı
Manufactures.
 
Nanotechnology.
 
Engineering.
 
Surfaces (Physics).
 
Chemistry, inorganic.
 
Manufacturing, Machines, Tools, Processes. http://scigraph.springernature.com/things/product-market-codes/T22050
 
Nanotechnology. http://scigraph.springernature.com/things/product-market-codes/Z14000
 
Nanotechnology and Microengineering. http://scigraph.springernature.com/things/product-market-codes/T18000
 
Characterization and Evaluation of Materials. http://scigraph.springernature.com/things/product-market-codes/Z17000
 
Tribology, Corrosion and Coatings. http://scigraph.springernature.com/things/product-market-codes/Z15000

Ek Kurum Yazar
SpringerLink (Online service)

Elektronik Erişim
https://doi.org/10.1007/978-3-319-77872-3


Materyal TürüBarkodYer NumarasıDurumu/İade Tarihi
Electronic Book223457-1001TS1 -2301Springer E-Book Collection