Search Results for SpringerLink (Online service) - Narrowed by: Characterization and Evaluation of Materials. - Nanotechnology. SirsiDynix Enterprise https://catalog.tedu.edu.tr/client/tr_TR/defaulttr/defaulttr/qu$003dSpringerLink$002b$002528Online$002bservice$002529$0026qf$003dSUBJECT$002509Konu$002509Characterization$002band$002bEvaluation$002bof$002bMaterials.$002509Characterization$002band$002bEvaluation$002bof$002bMaterials.$0026qf$003dSUBJECT$002509Konu$002509Nanotechnology.$002509Nanotechnology.$0026ic$003dtrue$0026ps$003d300? 2024-09-07T04:38:39Z Nanomechanical Analysis of High Performance Materials ent://SD_ILS/0/SD_ILS:25223 2024-09-07T04:38:39Z 2024-09-07T04:38:39Z Yazar&#160;Tiwari, Atul. editor.<br/><a href="http://dx.doi.org/10.1007/978-94-007-6919-9">http://dx.doi.org/10.1007/978-94-007-6919-9</a><br/>Format:&#160;Electronic Resources<br/> Trends in Nanoscale Mechanics Mechanics of Carbon Nanotubes, Graphene, Nanocomposites and Molecular Dynamics ent://SD_ILS/0/SD_ILS:25463 2024-09-07T04:38:39Z 2024-09-07T04:38:39Z Yazar&#160;Harik, Vasyl. editor.<br/><a href="http://dx.doi.org/10.1007/978-94-017-9263-9">http://dx.doi.org/10.1007/978-94-017-9263-9</a><br/>Format:&#160;Electronic Resources<br/> Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method ent://SD_ILS/0/SD_ILS:223457 2024-09-07T04:38:39Z 2024-09-07T04:38:39Z Yazar&#160;Seok, Seonho. author.<br/><a href="https://doi.org/10.1007/978-3-319-77872-3">https://doi.org/10.1007/978-3-319-77872-3</a><br/>Format:&#160;Electronic Resources<br/> Comparators in Nanometer CMOS Technology ent://SD_ILS/0/SD_ILS:24507 2024-09-07T04:38:39Z 2024-09-07T04:38:39Z Yazar&#160;Goll, Bernhard. author.<br/><a href="http://dx.doi.org/10.1007/978-3-662-44482-5">http://dx.doi.org/10.1007/978-3-662-44482-5</a><br/>Format:&#160;Electronic Resources<br/> Polymer Engineering Science and Viscoelasticity An Introduction ent://SD_ILS/0/SD_ILS:19832 2024-09-07T04:38:39Z 2024-09-07T04:38:39Z Yazar&#160;Brinson, Hal F. author.<br/><a href="http://dx.doi.org/10.1007/978-1-4899-7485-3">http://dx.doi.org/10.1007/978-1-4899-7485-3</a><br/>Format:&#160;Electronic Resources<br/> RHEED Transmission Mode and Pole Figures Thin Film and Nanostructure Texture Analysis ent://SD_ILS/0/SD_ILS:19767 2024-09-07T04:38:39Z 2024-09-07T04:38:39Z Yazar&#160;Wang, Gwo-Ching. author.<br/><a href="http://dx.doi.org/10.1007/978-1-4614-9287-0">http://dx.doi.org/10.1007/978-1-4614-9287-0</a><br/>Format:&#160;Electronic Resources<br/> Micro-scaled Products Development via Microforming Deformation Behaviours, Processes, Tooling and its Realization ent://SD_ILS/0/SD_ILS:19523 2024-09-07T04:38:39Z 2024-09-07T04:38:39Z Yazar&#160;Fu, Ming Wang. author.<br/><a href="http://dx.doi.org/10.1007/978-1-4471-6326-8">http://dx.doi.org/10.1007/978-1-4471-6326-8</a><br/>Format:&#160;Electronic Resources<br/> Poly-SiGe for MEMS-above-CMOS Sensors ent://SD_ILS/0/SD_ILS:25207 2024-09-07T04:38:39Z 2024-09-07T04:38:39Z Yazar&#160;Gonzalez Ruiz, Pilar. author.<br/><a href="http://dx.doi.org/10.1007/978-94-007-6799-7">http://dx.doi.org/10.1007/978-94-007-6799-7</a><br/>Format:&#160;Electronic Resources<br/>