Search Results for Engineering. - Narrowed by: Electronics and Microelectronics, Instrumentation. - Engineering Thermodynamics, Heat and Mass Transfer. - Thermodynamics.SirsiDynix Enterprisehttps://catalog.tedu.edu.tr/client/tr_TR/defaulttr/defaulttr/qu$003dEngineering.$0026qf$003dSUBJECT$002509Konu$002509Electronics$002band$002bMicroelectronics$00252C$002bInstrumentation.$002509Electronics$002band$002bMicroelectronics$00252C$002bInstrumentation.$0026qf$003dSUBJECT$002509Konu$002509Engineering$002bThermodynamics$00252C$002bHeat$002band$002bMass$002bTransfer.$002509Engineering$002bThermodynamics$00252C$002bHeat$002band$002bMass$002bTransfer.$0026qf$003dSUBJECT$002509Konu$002509Thermodynamics.$002509Thermodynamics.$0026ic$003dtrue$0026ps$003d300?2024-08-18T16:45:19ZWafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applicationsent://SD_ILS/0/SD_ILS:199182024-08-18T16:45:19Z2024-08-18T16:45:19ZYazar Qu, Shichun. author.<br/><a href="http://dx.doi.org/10.1007/978-1-4939-1556-9">http://dx.doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Electronic Resources<br/>Thermal Transport in Oblique Finned Micro/Minichannelsent://SD_ILS/0/SD_ILS:213682024-08-18T16:45:19Z2024-08-18T16:45:19ZYazar Fan, Yan. author.<br/><a href="http://dx.doi.org/10.1007/978-3-319-09647-6">http://dx.doi.org/10.1007/978-3-319-09647-6</a><br/>Format: Electronic Resources<br/>