Search Results for - Narrowed by: Springer E-Book Collection - Engineering Thermodynamics, Heat and Mass Transfer. - Electronics and Microelectronics, Instrumentation. SirsiDynix Enterprise https://catalog.tedu.edu.tr/client/tr_TR/defaulttr/defaulttr/qf$003dLOCATION$002509Lokasyon$0025091$00253ASPRINGER$002509Springer$002bE-Book$002bCollection$0026qf$003dSUBJECT$002509Konu$002509Engineering$002bThermodynamics$00252C$002bHeat$002band$002bMass$002bTransfer.$002509Engineering$002bThermodynamics$00252C$002bHeat$002band$002bMass$002bTransfer.$0026qf$003dSUBJECT$002509Konu$002509Electronics$002band$002bMicroelectronics$00252C$002bInstrumentation.$002509Electronics$002band$002bMicroelectronics$00252C$002bInstrumentation.$0026ps$003d300? 2024-05-22T05:47:17Z Handbook of Thermal Science and Engineering ent://SD_ILS/0/SD_ILS:226471 2024-05-22T05:47:17Z 2024-05-22T05:47:17Z Yazar&#160;SpringerLink (Online service)<br/><a href="https://doi.org/10.1007/978-3-319-26695-4">https://doi.org/10.1007/978-3-319-26695-4</a><br/>Format:&#160;Electronic Resources<br/> Thermal Transport in Oblique Finned Micro/Minichannels ent://SD_ILS/0/SD_ILS:21368 2024-05-22T05:47:17Z 2024-05-22T05:47:17Z Yazar&#160;Fan, Yan. author.<br/><a href="http://dx.doi.org/10.1007/978-3-319-09647-6">http://dx.doi.org/10.1007/978-3-319-09647-6</a><br/>Format:&#160;Electronic Resources<br/> Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications ent://SD_ILS/0/SD_ILS:19918 2024-05-22T05:47:17Z 2024-05-22T05:47:17Z Yazar&#160;Qu, Shichun. author.<br/><a href="http://dx.doi.org/10.1007/978-1-4939-1556-9">http://dx.doi.org/10.1007/978-1-4939-1556-9</a><br/>Format:&#160;Electronic Resources<br/>