Search Results for - Narrowed by: Springer E-Book Collection - Engineering Thermodynamics, Heat and Mass Transfer. - Electronics and Microelectronics, Instrumentation.SirsiDynix Enterprisehttps://catalog.tedu.edu.tr/client/tr_TR/defaulttr/defaulttr/qf$003dLOCATION$002509Lokasyon$0025091$00253ASPRINGER$002509Springer$002bE-Book$002bCollection$0026qf$003dSUBJECT$002509Konu$002509Engineering$002bThermodynamics$00252C$002bHeat$002band$002bMass$002bTransfer.$002509Engineering$002bThermodynamics$00252C$002bHeat$002band$002bMass$002bTransfer.$0026qf$003dSUBJECT$002509Konu$002509Electronics$002band$002bMicroelectronics$00252C$002bInstrumentation.$002509Electronics$002band$002bMicroelectronics$00252C$002bInstrumentation.$0026ps$003d300?2024-05-22T05:47:17ZHandbook of Thermal Science and Engineeringent://SD_ILS/0/SD_ILS:2264712024-05-22T05:47:17Z2024-05-22T05:47:17ZYazar SpringerLink (Online service)<br/><a href="https://doi.org/10.1007/978-3-319-26695-4">https://doi.org/10.1007/978-3-319-26695-4</a><br/>Format: Electronic Resources<br/>Thermal Transport in Oblique Finned Micro/Minichannelsent://SD_ILS/0/SD_ILS:213682024-05-22T05:47:17Z2024-05-22T05:47:17ZYazar Fan, Yan. author.<br/><a href="http://dx.doi.org/10.1007/978-3-319-09647-6">http://dx.doi.org/10.1007/978-3-319-09647-6</a><br/>Format: Electronic Resources<br/>Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applicationsent://SD_ILS/0/SD_ILS:199182024-05-22T05:47:17Z2024-05-22T05:47:17ZYazar Qu, Shichun. author.<br/><a href="http://dx.doi.org/10.1007/978-1-4939-1556-9">http://dx.doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Electronic Resources<br/>