Search Results for - Narrowed by: English - Electronics and Microelectronics, Instrumentation. - Heat transfer.SirsiDynix Enterprisehttps://catalog.tedu.edu.tr/client/tr_TR/defaulttr/defaulttr/qf$003dLANGUAGE$002509Dil$002509ENG$002509English$0026qf$003dSUBJECT$002509Konu$002509Electronics$002band$002bMicroelectronics$00252C$002bInstrumentation.$002509Electronics$002band$002bMicroelectronics$00252C$002bInstrumentation.$0026qf$003dSUBJECT$002509Konu$002509Heat$002btransfer.$002509Heat$002btransfer.$0026ps$003d300?2024-09-23T12:36:40ZWafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applicationsent://SD_ILS/0/SD_ILS:199182024-09-23T12:36:40Z2024-09-23T12:36:40ZYazar Qu, Shichun. author.<br/><a href="http://dx.doi.org/10.1007/978-1-4939-1556-9">http://dx.doi.org/10.1007/978-1-4939-1556-9</a><br/>Format: Electronic Resources<br/>Thermal Transport in Oblique Finned Micro/Minichannelsent://SD_ILS/0/SD_ILS:213682024-09-23T12:36:40Z2024-09-23T12:36:40ZYazar Fan, Yan. author.<br/><a href="http://dx.doi.org/10.1007/978-3-319-09647-6">http://dx.doi.org/10.1007/978-3-319-09647-6</a><br/>Format: Electronic Resources<br/>